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Copper foil, Low roughness rolled copper foil
Extensive rolling experience has been applied to yield copper foils with very low surface roughness.
Characteristics
Exceptional Rz0.4μm surface roughness
Suitable for fine pattern circuits
Suitable for pattern circuits resilient to surface effects appearing in high frequency (GHz) applications
Specifications
Material Tough pitch copper
Thickness 8～35μm
Width 250～650mm
Surface treatment supplied simply as a foil, surface can be roughened on request
Applications
Fine patterns, printed wiring boards for high frequency applications, and others
Properties
Mechanical, electric properties (12μm thickness)
Item median value
Tensile strength (MPa) 450
Elongation (%) 1.4
Electronic conductivity (%IACS) 101
Surface roughness
Materials and methods SRM AFM
Rz Ra Rz Ra
ES foil 0.4 0.05 0.24 0.13
Our general rolled copper foil 0.7 0.09 0.40 0.31
Electrolyzed copper foil
surface - M		 1.5 0.27 1.2 0.26
Electrolyzed copper foil
surface - S		 18 0.33 1.3 0.27
Test Conditions Radius of stylus reach　　2μm
Length　　0.8mm
Speed　　0.1mm/s
Cut off　　0.25mm 		Radius of probe reach　　0.05μm
Length　　1.0mm
Speed　　0.67mm/s
Cut off　　0.32mm
Surface photo　 Configuration
The above are median values, not standards.
Surface photo (SEM image)
ES　Rz 0.4μm(SRM) (Reference)
Our general rolled copper foil
Rz 0.7μm(SRM)
(Reference)
Electrolyzed copper foil – Surface M
Rz 1.5μm(SRM) 		(Reference)
Electrolyzed copper foil – Surface S
Rz 1.8μm(SRM)
Rz value from SEM
表面形状(AFM像)
Surface configuration (AFM image)
(Reference)Our general rolled copper foil　Rz 0.40μm(AFM)
(Reference)Electrolyzed copper foil – Surface M　Rz 1.2μm(AFM)
(Reference)Electrolyzed copper foil – Surface S　Rz 1.3μm(AFM)
Rz value from AFM
Copper/Copper alloy foil
With characteristics superior to solid copper foils（tough pitch, oxygen-free or electrolyzed foils）
Characteristics
High durability
High temperature resistance/High thermal stability
High resilience
Available in larger widths
Specifications
Material (wt%) Example alloys (other materials also available)
C14410 （Cu- 0.15Sn）
C18040 （Cu- 0.3Cr- 0.25Sn- 0.2Zn）
Thickness 12～35μm
Width 250～650mm
Surface treatment Supplied simply as foil, surface can be roughened on request
Applications
High performance printed wiring boards, micro high density contact materials, and others.
Properties
  Loading direction C14410 C18040 (Reference)
Tough Pitch Copper
12µm 18µm 12µm 18µm 12µm 18µm
Tensile
strength
(Mpa)		 horizontal 529 525 646 658 460 470
vertical 573 545 - 694 480 465
Elongation % horizontal 2.0 2.6 2.1 2.9 1.3 2.0
vertical 2.6 2.5 - 3.6 1.2 1.0
Annealed
tensile
strength
(MPa)		 horizontal 162
(500ºC)		 201
(500ºC)		 282
(600ºC)		 279
(600ºC)		 175
(200ºC)		 200
(200ºC)
vertical 170
(500ºC)		 180
(500ºC)		 - 270
(600ºC)		 145
(200ºC)		 180
(200ºC)
Annealed
elongation %		 horizontal 10.4
(500ºC)		 18.5
(500ºC)		 10.6
(600ºC)		 19.4
(600ºC)		 10.7
(200ºC)		 14.9
(200ºC)
vertical 13.8
(500ºC)		 17.1
(500ºC)		 - 21.3
(600ºC)		 10.3
(200ºC)		 11.8
(200ºC)
Electrical
conductivity
(%IACS)		 - 85 71 100
The above are median values, not standards.